Thanks for the suggestions.

I should have mentioned I am concerned about ESD damage of my sample
so hesitate to use Kapton tape (although may not be a problem if I do
everything on a grounded surface).

Someone also suggested the products CrystalBond and WaferBond which look
promising.

I'll experiment with a few different methods and see how it goes.

Best regards

Gareth

On 26 August 2010 21:36, Alex Mellnik  wrote:

> Hi Gareth,
>
> I used to work with very thin germanium chips which would sometimes shatter
> when spinning or exposing.  I tried a few different things (varnish, wax),
> but ended up mounting them on larger silicon chips with two or three narrow
> strips of thin double-sided kapton tape.  It was robust enough to go through
> all normal processing (190C was the max temperature it saw) and it turns out
> that while it is very resistant to acetone and IPA, if you soak it for a
> while in TCE, it will slide right off.  It helps if you keep it flat and off
> the bottom of the beaker when you do this, otherwise you can end up with
> bits of polymer gunk on your devices.  If you use thin enough strips of tape
> you may also be able to carefully slide it off without the TCE depending on
> how fragile your dies are.
>
> Also, I remember that it can be a bit tricky to spin even layers of SU8 on
> very small samples, and be careful to not get the SU8 between the die and
> whatever you mount it on.
>
> Good luck,
>
> Alex