How about using photoresist to 'glue' your chips onto a bigger chip/wafer?

Here at Glasgow Uni several people have used such an approach with
success (many work with samples as small as 4 mm by 4 mm). S1818 is the
resist of choice but I can't see why other photoresists would not work.

If you want further details on the procedure let me know.

Gareth Jenkins wrote:
> Thanks for the suggestions.
>
> I should have mentioned I am concerned about ESD damage of my sample
> so hesitate to use Kapton tape (although may not be a problem if I do
> everything on a grounded surface).
>
> Someone also suggested the products CrystalBond and WaferBond which look
> promising.
>
> I'll experiment with a few different methods and see how it goes.
>
> Best regards
>
> Gareth

--
Dr. James Paul Grant
Postdoctoral Research Associate
Microsystems Technology Group
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