Hi Everyone,

I am working on forming thin film thermoelectrets with a system
typically used for anodic or thermal compression bonding, think Suss or
EVG bonder.  I am not having any serious success according to the
electrostatic volt meter.  I have done a good amount of reading but I
figure I am missing something basic.

My main materials are PI-2611 and AF Teflon.   These materials are spin
cast on a Silicon wafer and solvent is baked out at 90C before loading
between "dummy" wafers.

I welcome comments and advice.

Best Regards

Mark Crain
Cleanroom Manager & PhD Student
University of Louisville
[email protected]