Hi,
You have to use in this BOSCH process gases like
SF6+O2 in the etch phase and C4F8 in the passivation phase.
The oxygen used helps in sidewall passivation and also control the excessive
lateral etch rate. A balance between SF6 and O2 provides the desired etch rate
.
by increasing RF power and pressure you cant achieve a high etch rate like
3.5 ¦Ìmmin
recipe :
Etch cycle: (25¨C30 mTorr), 130 sccm SF6, 13 sccm O2,
600 W Coil/23 W RF
Passivation cycle (15¨C20 mTorr), 120 sccm C4F8,
600 W coil,
Total process time: 60 min
Regards to all .
Naitbouda Abdelyamine
Process Engineer in the Dry etch area
of the Clean Room of the CDTA.
Centre de Developpement des Technologies Avanc¨¦es
Cite du 20 Aout 1956 Baba Hassen,Alger,Algerie
[email protected]
