Wondering if anyone has any experience anodic-bonding pyrex wafers to silicon
wafers, where the pyrex is thicker than normal.

For a 100mm wafer typical thicknesses I've worked with are in the 400-600um
range.
Has anyone had experience working with wafers 2 or 3 times thicker?

Rob MacDonald
Shearwater Scientific

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Hi Rob,

I have anodic bonded Pyrex to silicon in up to a few mm thicknesses. Thickness
of the Pyrex makes no discernible difference in the bond as long as the
interface is at temperature.

A simple hotplate bonder does not always suffice as the thermal insulation of
the Pyrex makes the junction a bit colder. The two solutions are to bond Pyrex
up and/or put a "tent" over the fixture to make it into a mini oven and block
cooling air currents.

The tent is a good idea even with silicon down as it makes the temperature
across the glass more uniform and therefore reduces bonded in stress.

Best,
Dean
(408) 429-0501