Hi all

I'm having a problem with the Au/Ti adhesion on glass wafer as follow :

I had finished the Au/Ti coating process on the glass wafer (piranha treated),
there is no problem. Then I used some of them for my experiment at that time
(the adhesion was good) and kept the others for the later use.

After a few days when I used the others and there was a problem with the Au/Ti
layer. They became sensitive and easily peel off even when washing with DI
water. I don't know why there is a different adhesion between the first and the
second time using. Does anyone face this problem before ?

Thank you

Binh Tran
MS Candidate - Nano System
Kyungwon University - Korea