Adhesion problem during 7740 glass wafer wet etching process
Andrew Sarangan
2010-12-16
You can try adjusting the argon pressure. Low pressure tends to give
dense films with compressive strain which can lead to buckle
delamination.
On Tue, Dec 14, 2010 at 12:44 AM, Xin Yan wrote:
> thank you Andrew, I also think the sputtering Cr film should have lots of
> problem. But the Sputtering is the only way to deposit Cr in our lab. i
> think what if i change the recipe of the sputtering, the film could become
> more dense.
>