Hello,

What about making first alignment marker on your wafer. Then for the first
exposure you align to them. for the second one, you align again to the same
alignment marker then you shift 5 um as you wish and you expose again?

Regards

> ________________________________
> From: Ciro Chiappini 
> To: General MEMS discussion 
> Sent: Thu, February 17, 2011 12:43:11 AM
> Subject: [mems-talk] K. SUSS MA6 Double exposure
>
> Hello
>
> I need to run a double exposure in vacuum contact mode with a K. Suss
> MA6 tool. The two exposures must be shifted by roughly 5 microns, but
> I don't have a way to visually align them.
>
> The process I was going to run was: load, WEC, bring wafer to contact,
> expose, bring back to alignment separation, slide 5um on the
> micromanipulator, bring to contact, expose, unload.
>
> If I run the standard exposure sequence, after the first exposure the
> tool requires to unload the wafer (and thus I'll lose my rough
> alignment)
>
> The easiest way I see to accomplish this is to use the light intensity
> check button on the tool, that allows to operate the UV light
> independently. Unfortunately that button is not functional while a
> substrate is present.
>
> Has anyone ever been able to override the standard exposure sequence on an
MA6?
>
> I Have easily run this protocol on an EVG620 with the low level IO,
> but I need to expose 600nm features and our EVG620 cannot resolve
> them.
>
> Thanks for your help.