Hello @all,

currently I am working on a planar coil fabricated on a glass substrate. The
structure starts with an Al-layer, 1µm thickness. Since its resistance is
much too high because of the poor aspect ratio, I want to use electroless
plating for decreasing it. For this I used an UBM-process , consisting of
Zn, Ni and finally Au. Final thickness is about 5µm. But I wonder about the
resistance which gets doubled after electroless plating. Any suggestions
what could have gone wrong?

Best regards, Chris