Hi Chris,

I have experienced electrical isolation by an insufficiently removed oxide
layer in electrolytic NiFe on NiFe seed. I think you're right.

Maybe you could increase the time of the selective de-ox step?
The de-ox I use, MacDermid's Isoprep 184 is very selective to oxide removal
without attacking Al(2%Cu) in nano-applications.

Good luck,
Dave

David Roberts (Wafer Plating Specialist)
Prodigy Surface Tech (408) 469-3203 cell
807 Aldo Ave., Suite 103
Santa Clara, CA 95054
Phone (408) 492-9390
FAX (408) 492-9391

-----Original Message-----
From: Christian Engel [mailto:[email protected]]
Sent: Friday, March 18, 2011 2:56 AM
To: 'General MEMS discussion'
Subject: Re: [mems-talk] Electric problem after electroless plating

Hi Dave,

I already used an acid zincate process. Minimizing pre-etching I also tried.
Sometimes it works but often the structures peel-of after the Ni-Step. After
succesful plating of  a sample I always have those high ohmic resistances...
And I wonder. Perhaps an oxid grows anywhere between two layers?

Chris