I am trying to electroplate Ni (1um thick) bars on Cr thin film (50nm) which
serves as a seed layer.

But after electroplating, I found the adhesion is very weak. Using tweezers
can easily scratch the Ni bar off the Cr surface without any damage to the
Cr surface, which indicates very weak adhesion.

I know that Cr may oxidized in air. Does the oxidation count for the weak
adhesion?

Did anyone has similar experiences? I am crazy now:P

Thanks ahead.