Thanks all. The reason I chose Cr is that it can be dry etched to leave my
substrate transparent (glass substrate).

I need to remove any seed layer outside the electroplating area. Cu seeds
hard to be removed by etching.

Anyway, I will try Cr/Au first and update here.

On Mon, May 23, 2011 at 10:44 AM,  wrote:

> I have tried electroplating Ni and Cu directly on a Cr seed layer with no
> luck. The electroplated Ni and/or Cu have no adhesion.
>
> For copper, I've used a seed layer of Cr for adhesion and a thin Cu layer
> to be able to electroplate Cu on top of it. Both Cr seed and thin Cu
> layers were deposit by sputtering. Other possibility is to use Ti as
> adhesion. I'm not able to deposit Ni at the moment, but I would suggest
> the same method for the Ni electroplating or you could use a Cu layer and
> electroplate Ni over it. This should not be a problem.
>
> regards
>
> Gustavo Rehder
> Universisty of São Paulo