How about Ti. It can be etched real quick.

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Xiaohui
Lin
Sent: Monday, May 23, 2011 10:24 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Electroplating Ni on Cr thin film

Thanks all. The reason I chose Cr is that it can be dry etched to leave my
substrate transparent (glass substrate).

I need to remove any seed layer outside the electroplating area. Cu seeds
hard to be removed by etching.

Anyway, I will try Cr/Au first and update here.