I have a dicing problem question. I do not know where the Pt dust particles came
from. I believe that they came after we diced the Pt/Ti/SiO2/Si wafer. How
should
we clean the wafer? I was thinking about using excessive use of DI water. Do you
have a better idea?


Thank you,

Joseph Y. Lee
Senior Engineer
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Corporate Technology Operations Headquarters
Micro Fab Group

TEL: 82-31-300-7331
Mobile: 82-10-3332-1440