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MEMSnet Home: MEMS-Talk: dicing problem with silicon wafer
dicing problem with silicon wafer
2011-05-31
이요석
2011-05-31
Gary Hillman
2011-05-31
Bill Moffat
2011-05-31
Ruiz, Marcos Daniel (SENCOE)
2011-06-01
이요석
2011-06-02
Jie Zou
2011-06-02
Bill Moffat
2011-06-02
Ruiz, Marcos Daniel (SENCOE)
2011-06-10
Jun Hao
2011-06-10
Ned Flanders
2011-06-10
Bill Moffat
dicing problem with silicon wafer
Bill Moffat
2011-06-10
It may sound like a commercial but be sure to use vacuum vapor prime for HMDS
treatment.  The reason the HMDS treatment lasts is the vacuum pretreament
removes all moisture.  Bill Moffat

________________________________________
From: [email protected] [mems-talk-
[email protected]] on behalf of Ned Flanders
[[email protected]]
Sent: Friday, June 10, 2011 9:55 AM
To: General MEMS discussion
Subject: Re: [mems-talk] dicing problem with silicon wafer

I've once patterned the primed surface (some areas had the HMDS
monolayer, others didn't), and even with long periods of sonication in
acetone, the HMDS monolayer would happily stay on. I was very
impressed


m
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