your current density is too high. look at the following paper.

Effects of Process Conditions on Properties of Electroplated Ni
Thin Films for Microsystem Applications
Journal of The Electrochemical Society, 153 (10) D155-D161 (2006)

Good luck,
IEG


--- On Tue, 7/5/11, Shree Narayanan  wrote:


From: Shree Narayanan 
Subject: [mems-talk] Nickel electroplating stress issue
To: [email protected]
Date: Tuesday, July 5, 2011, 11:35 PM


Hello All,

I am attempting to electroplate nickel of 100um thickness on Ti/Au seed
layer. I am using Technic Nickel Sulphamate RTU solution at 45C with 150rpm
magnetic stirring. The pH was monitored to be at 4 and the current density
maintained at 70mA/cm2.

After 2 hours of plating, the stress is huge that it strips from the pyrex
substrate. I have also added 1g/L saccharin but to no use. Can someone give
me some pointers on how to tackle this stress issue.

A link to an optical image of the metal stripping out of the surface and
looking skywards:).

http://www.box.net/shared/nkp95tltba58382laydc

Thanks for your time.
Shree