Hi,
try to give a look at nikka seiko products,
http://www.nikkaseiko.co.jp/eng/

Best regards,
Andrea

> Hi,
>
> I'd like to use an intermediate material to "bond" device wafer to dummy
> Si wafer for dicing. The "bonding" strenth may not be very strong.
>
> The main goals are to reduce chipping on the device wafer during dicing,
> and easy to clean at the same time. positive photoresist could be an
> option..  Does any one know any material that is suitable for this
> application? It could be low cost, not toxicate,  and easy for cleaning
>
> Thanks a lot!