In my experience the NR9 series is very dependent on soft-bake temperature,
so I would start by varying that.

-Alex

On Thu, Sep 8, 2011 at 12:16 PM, Xiaohui Lin wrote:

> Hi guys I am having a difficult time dealing with NR9-1000P lithography on
> glass substrate (1mm thick) coated with Cr/Au (50nm).
>
> It is a clear field mask, so only the pattern region (5um lines) are not
> exposed and developed away
>
> spin coat thickness is 1um at 3000rpm
>
>
> I found that, when exposing using MA6 Ch1 (7.5mJ) for 20s, line will be
> almost closed out. But if reduce the time, the bottom may not get enough
> expose.
>
> Could anyone suggest the way to optimize the process?