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MEMSnet Home: MEMS-Talk: DRIE Through-Hole Vias in Glass/Pyrex Substrate
DRIE Through-Hole Vias in Glass/Pyrex Substrate
2011-09-23
Helen Schwerdt
2011-09-26
Matthieu Nannini, Dr.
2011-09-27
ashwini jambhalikar
DRIE Through-Hole Vias in Glass/Pyrex Substrate
Helen Schwerdt
2011-09-23
Hi,

Would anyone know of any DRIE glass etching services for creating
through-hole vias in 500 micron thick glass wafers? I am having
trouble finding a specific vendor or academic institution that offers
these services for R&D (not ongoing mass production) at a reasonable
price. Thanks for any information in advance,

helen
reply
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