Hi,

Thank you guys for replying. Actually, when I asked 'etching', I did mean the
plasma sputter off material. Because I have other components on some area of the
wafer, the wet etching process can damage my components. So, I am thinking an
inert Ar plasma may be better choice to remove the 100nm Au and Cr.

If any of you could give me something to start with, then I may be able to work
out my own parameters more quickly.

Thanks again.

Yingtao