using FIB milling to cut the x-section.


On Tue, 08 Nov 2011 00:38:34 +0800, ning xue  wrote:

> Hi,
>
> I am planing to have a look at the cross section of my deep silicon
> etching
> sample by SEM. I found that it is really difficult to manually cut the
> slicon sample right along the diameter of the etcher hole. Is there any
> good way to cut the wafer nicely and the cut side goes through the center
> of etched hole?
>
> Thanks
> Ning

--
Sincerely
Jack, Zetao MA
Dept.of EEE, CYC712,HKU