Hi,

If possible, you can pattern a "pre-defined cutting line" which is
aligned to the center of you hole at the same time when you are doing
your DRIE (see attached pic). After that, you can break the wafer
alone the pre-cutted line and the crack will go along with the crystal
direction giving you a really smooth side wall.

2011/11/7 ning xue :
> Hi,
>
> I am planing to have a look at the cross section of my deep silicon etchi=
ng
> sample by SEM. I found that it is really difficult to manually cut the
> slicon sample right along the diameter of the etcher hole. Is there any
> good way to cut the wafer nicely and the cut side goes through the center
> of etched hole?
>
> Thanks
> Ning