Hi Shib,

The SU-8 2000s developer is PGMEA. This PGMEA is the solvent in AZ4620 that you
expel by its soft bake.

If you cannot replace SU-8 by another resist (eg AZ125nXT or photostructured
PDMS) you could replace the sacrificial layer: just electroform your sacrificial
layer and finally etch the metal. We do
this with copper sacrificial layers.

Regards

Felix

On 20:59, Shiv GD wrote:
> Hello Everyone,
>
> I am working on a Microchannel device, and facing some problem with AZ 4620
> and SU-8 Layer. The device is fabricated on a glass substrate and I am
> using AZ 4620 as sacrificial layer ( I need ~20um height). I patterned the
> AZ layer using standard lithography process ( Spincoat, Bake on Hotplate
> for 2mins @ 110'C, Expose and Develop using AZ 400K. ) and I want to keep
> it until the last step. I than, spincoat SU-8 2025 (on top of the AZ 4620
> layer), bake, expose, post bake. But when I try to develop the SU-8
> structure ( using Microchem SU-8 developer ), I observe that the SU-8
> structure develops alright but the AZ sacrificial layer is gone. As a
> result the SU-8 structure collapse, cracks and I can't continue to the next
> step.
>
> What do you think I can do to resolve the situation ? Please suggest.
>
> Your help is much appreciated.
>
> Thank you.
>
> Shib
>