We are looking for someone with capability to do double-sided exposure of a few
6" wafers for some preliminary tests.
Does anyone out there have equipment to do this? If so, what are your alignment
accuracy and minimum feature size?
Thanks,
Leslie
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************* __ ************* Leslie Field
*********** / / ************ Project Leader - Micromechanics
********* / / ********* Solid-State Technology Laboratory
******* / /___ ______ ******* Hewlett-Packard Laboratories
****** / __ // __ / ****** email: [email protected]
****** / / / // /_/ / ****** US Mail: 3500 Deer Creek Road
******* /_/ /_// ____/ ******* Building 26M-2
******** / / ********* Palo Alto, CA 94304
********** / / *********** Phone: (415) 857-5042
*********** /_/ *************** Fax: (415) 852-8626
