I am wondering if anyone has a good reference for the change in line widths
with change in thin film thickness when performing wet chemical etching. If
a thin film was essentially a shadow masked gradient from 0-1000Å over
several inches, I would expect that in order to resolve a pattern across
the whole thin film, that the CDs would vary quite a bit from end to end
just based upon the thin film thickness (thinner should be narrower in
general, thicker should be fatter in general). It should also depend on the
density of the pattern as well, and whether a lot or a little bit of
material is being removed around the line being left behind, and how much
that effects the local concentration of the etchant.

Just wondering if there is something out there from years past, I haven't
been able to find any relevant papers with a bit of searching.

Sincerely,
Dave
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