I am attempting to build a simple anodic bonder (based on another product
which has a 6" heated platen).

Could anybody tell me, is there any reason that we have to test it under
vacuum, other than to keep air bubbles and particles out of the bond?

Also, where can I get a small quantity (say 5 off) of  4" or 6" silicon
wafers, sputter coated on one side with 4 microns of pyrex, and also a
similarly small  quantities of thin pyrex frits, between 0.5 and 2 mm thick?


I take it that if I am bonding Si to glass, that I don't need to sputter
coat the Si i.e. that this is only necessary to bond Si to Si?


Dr. Ken Macfarlane,
Development Dept., Logitech Ltd.,
Erskine Ferry Rd., Old Kilpatrick,
Glasgow G60 5EU, Scotland.
Voice: 01 389 804405 (direct dial)
Fax :  01 389  879042
Work: [email protected]
website: www.logitech.uk.com