Image reversal allows side wall angle to be manipulated from -22 degrees through
vertical to + 22 degrees.  We have run 40 micron thick photoresist.  We have
never experimented with photo sensitive Polyimide but I am willing to run free
tests because I am sure it would work.  Vertical side walls thick protective
layer,  with the chemical and heat resistance of Polyimide.  Sounds like the
solution you require.  Bill Moffa

Mr. Lu,

Thanks for the information. I am trying to etch 200u+ deep channels. Does
crystal bonding work to this depth? I attempted thermal grease but local heating
effects etched the photoresist away quickly in certain parts. Would you be able
to comment on the sidewall angle for the structures you had etched?

Thanks
Shree

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