A mounting wax or specialist temporary bonding layers are your best bet (make
sure get a variant with a high enough temperature capability) - Tian Tang's
earlier reply summed up options pretty nicely. The key challenge when mounting
such a large area is avoiding voids during the temporary bonding process that
can lead to areas of poor uniformity of thermal conduction whatever material you
choose to use.

For smaller areas (up to about 2-3"), mounting is much easier. A thin layer of
Fomblin oil can work pretty well if you get the distribution right and can be
removed with IPA. I have also used Cool-grease for small pieces in the past with
reasonable results (but it is harder to remove).

I would not recommend using photoresist as the thermal transfer layer for a deep
silicon etch, particularly if etching at more than a 1-2um/min. It can be
challenging to get the process set up for consistent results.

Best Regards,

Mark

Mark McNie
Principal Applications Engineer (MEMS)
Oxford Instruments Plasma Technology

>
> -----Original Message-----
> From: [email protected] [mailto:
> [email protected]] On Behalf Of Shree
> Narayanan
> Sent: Wednesday, December 05, 2012 10:36 AM
> To: General MEMS discussion
> Subject: [mems-talk] Adhesive to bond onto a carrier wafer for etching
>
> Hello all,
>
> I need to mount a 4" silicon wafer on a 6" metallized carrier wafer,
> in order to etch it in a Alcatel deep-reactive ion etcher. I am
> wondering if someone has used thermal vacuum grease for this purpose
> that can be removed easily at the end. The silicon wafer is patterned
> with photoresist and has no other material on it.
>
> Thanks
> Shree
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