Perhaps try covering the wafer in the resist solvent before pouring the
resist? This may help fill the gaps.

On 21 December 2012 02:57, João Tiago dos Santos Fernandes <
[email protected]> wrote:

> Hi everyone,
>
> I'm currently using AZ 40XT thick photoresist to make a 20-30 µm thin film
> over a Si sample with ~30 µm high SU-8 features.
>
> The problem I am facing is the following: when I pour the AZ on top of the
> sample, tiny air-bubbles are created in areas where SU-8 features are small
> (small wells, gaps, etc) - I'm guessing that this happens because the AZ is
> very viscous and isn't able to fill those spaces and traps air. When I spin
> coat, those tiny air bubbles are spread across the sample, compromising the
> process.
>
> Is there any way to get the air bubbles out of the way without
> compromising the final film thickness? I tried low rpm for a couple of
> minutes, with no success.
>
> Thank you so much,
>
> -----------------------------
> João Tiago dos Santos Fernandes
>
> INESC Microsistemas e Nanotecnologias (INESC MN)
> Rua Alves Redol, 9
> 1000-029 Lisboa
> Portugal
>
> Tel: +351 213100237
> Email: [email protected]
> URL: www.inesc-mn.pt
>
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