Dear all,
      I am using SU 8 (2150) for thickness of 800um coated on Si wafer. But for
me problems are,

(1) air bubble formation during soft baking process.
(2)wavy surface when hight increases.
(3) regarding SU -8 development, it takes time in hours.
I hope there will be solution.

Thanking you.

Regards,
Rajiv Panigrahi
Research scholar
CeNSE, IISc Bangalore

Sent from my Xperia™ smartphone smartphone

-------- Original Message --------
Subject: [mems-talk] Spin-coating of thick photoresist over existing features
From: João Tiago dos Santos Fernandes 
To: "[email protected]" 
CC:

Hi everyone,

I'm currently using AZ 40XT thick photoresist to make a 20-30 µm thin film over
a Si sample with ~30 µm high SU-8 features.

The problem I am facing is the following: when I pour the AZ on top of the
sample, tiny air-bubbles are created in areas where SU-8 features are small
(small wells, gaps, etc) - I'm guessing that this happens because the AZ is very
viscous and isn't able to fill those spaces and traps air. When I spin coat,
those tiny air bubbles are spread across the sample, compromising the process.

Is there any way to get the air bubbles out of the way without compromising the
final film thickness? I tried low rpm for a couple of minutes, with no success.

Thank you so much,

-----------------------------
João Tiago dos Santos Fernandes

INESC Microsistemas e Nanotecnologias (INESC MN)
Rua Alves Redol, 9
1000-029 Lisboa
Portugal

Tel: +351 213100237
Email: [email protected]
URL: www.inesc-mn.pt

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