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MEMSnet Home: MEMS-Talk: No Subject
No Subject
1999-06-18
[email protected]
No Subject
[email protected]
1999-06-18
Message to be posted for Discussion:

Hello;

I am trying to find information regarding methods of releasing bonded wafers,
such as by acid attack of a sandwiched release layer.  Has anyone experience
with this sort of process?  I would like to hear from you.  Thanks.

-N. Ricks


reply
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