Hello All,

How to make the surface of the glass substrate rough (by up to 200 nm)
? And how does this roughness influence the anodic bonding process and
its interface ?

I could imagine that higher roughness in the order of few hundreds of
nm would create contact issues between Glass-Si wafers and lead to
voids .

Any useful info, pointer or reference literature, you can provide is
much appreciated.

Thanks a lot!
VJ
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