Dear Jocelyn,



I think the PEB temperature is o.k. (we use similar temperatures following
the datasheet). The crosslinking starts widely at that temperature but is
not really finished before you make a hard bake. If you want to remove the
resist after plating I would prefer the negative working plating resists AZ
15 nXT or AZ 125 nXT:

http://www.microchemicals.com/products/photoresists.html



Best regards,



Mit freundlichem Gruß



André Bödecker



Institut für Mikrosensoren, -aktoren und -systeme

Universität Bremen Fachbereich 1

Otto-Hahn-Allee1

28359 Bremen

Tel: 0421 218 62596



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