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MEMSnet Home: MEMS-Talk: SU8 for Au Plating
SU8 for Au Plating
2013-03-19
Jocelyn Ng
2013-04-04
Kevin Nichols
2013-04-04
Michael Martin
2013-04-03
André Bödecker
2013-04-03
Bill Moffat
2013-04-04
Jocelyn Ng
2013-04-04
André Bödecker
SU8 for Au Plating
Michael Martin
2013-04-04
Hi Jocelyn,
   In order to get it to come off well you will need to use OmniCoat
adhesion layer from Micro Chem before putting down the Su-8.  Then the
OmniCoat and SU-8 comes right off (in principle) with remover PG.

-Michael


On Tue, Mar 19, 2013 at 12:33 AM, Jocelyn Ng  wrote:

> Dear all,
>
> I'm using SU-8 2005.
> I soft bake at 65C_540S, exposure dose is 60mJ and post exposure bake at
> 95C-120S.
>
> Recently I encounter a problem where, after undergone gold plating process,
> photoresist residue remains.
> My stripping(remover PG) process is at 65C for an hour followed by acetone
> bath in ultrasonic.
> My plating temperature is about 45C for 25minutes.
>
> I tried to strip in remover PG for another 30minutes but nothing seemed to
> be working.
> I had tried using the same condition previously and did not encounter this
> problem.
>
> I need some advice or comments on this.
> Thanks a lot in advance.
>
> Best Regards,
> Jocelyn
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