> We start working on lithography and bonding process using  170 um thin
> fused silica  for microfluidic devices. We always got broken wafers.
> We are looking for materials and techniques for supporting the thin wafer.
> The support wafer should be easily removed after the device is assembled.

Dear Hong,

Suss MicroTec (www.suss.com) offers a large spectrum of temporary wafer
bonding processes and equipment, from lab to fab scale.

Check our website, or contact me off-list, and I will get you in contact
with our local organization.

--
Klaus Beschorner 
Suss MicroTec Bonder Products
Technical and Application Support

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