Hi Youmin:
If you can send me the output file from the crashed analysis, I might be
able to offer some insight into the cause of the crash. R14.5 is not an
unstable release for MAPDL applications. I doubt that R14.5 is the issue.
Some thoughts:
1. Do not use SOLID45. It is a legacy element that is no longer
supported. Use the current technology SOLID186. It will more robustly
interact with SOLID226.
2. SOLID226 should work. I generally use the MFS for most electro-static
structural evaluations, but the SOLID226 approach is the most recent
method. It should be fine. The most critical concern for either the
MFSor SOLID226 approach is excessive distortion in the air mesh. In
both
methods the movement of the structure distorts the air mesh. If the
structure experiences large motion, the air mesh is highly distorted. You
need to create an initial air mesh that is capable of being distorted into
its final position. This situation is relatively unique in FE, because a
coarse air mesh is often better than a fine air mesh. A coarse mesh can
more easily undergo large distortion without excessively deforming any of
the individual elements. Note: One of the reasons I prefer the MFS is
that the structural mesh and air mesh do not share nodes. You can have
fine structural mesh and a coarse air mesh. The coupled-field information
is mapped across the interface. The air and structural interface share the
same geometric space, but they do not share nodes.
Regards.
Daniel Shaw
Lead Technical Services Engineer
ANSYS, Inc.
--------------------------------------------------------------------------------
----------------------------------------
On Mon, Nov 4, 2013 at 2:01 PM, Youmin Wang wrote:
> Hi Friends,
>
> Actually, I want to state a little bit more on the meshing issue of my
> current study using Solid226. The problem I have is the Ansys program
> simply crashes when I try to solve. I searched online and somebody says the
> 14.5 versions are not really stable. But I think it might be the problem
> with the meshing. I wonder whether Daniel or anyone else has come into this
> problem before.
>
> Thanks.
>
>
> On Mon, Nov 4, 2013 at 11:54 AM, Youmin Wang wrote:
>
>> Hi Daniel,
>>
>>
>> Thank you for you kind help!
>>
>> After investigations done so far, I recognized that Trans126 element
>> might not be a good choice to be used in my tilting mirror applications.
>> Though the Ansys help manual indicated something as below:
>>
>> [image: Inline image 1]
>>
>> As you can see, the above figure is using Trans126 elements, though I
>> think it is a simplified model. I heard that Trans126 is good for
>> attraction, while difficult to perform the leaving electrodes. Beyond that.
>> I think my micromirror has more complicated geometry than the parallel
>> plates, I don't know this parallel-plate simplification would be a good
>> choice for it.
>>
>> As for now, I am considering to proceed with the Solid226 option, which
>> is exactly what you have suggested. I am trying to mesh the air gap between
>> the movable mirror and the fixed electrodes using Solid226 elements, while
>> leaving the other parts using Solid45. The electroelastic and structural
>> elements are joined through nodal connectivity at the interface between
>> them. I am still working on this direction right now, when the geometry
>> becomes more complicated, seems it get more difficult to converge, I have
>> many small parts to trim, such as the meshing and boundary conditions...
>>
>> Another option seems to be multi-field solver, which up-to-now I have not
>> acquired too much reference materials and did not dive in too deep yet.
>>
>> Again, thank you very much for your help and suggestions! I am really
>> grateful to you. If you could provide more insight, that would be really
>> great.
>>
>>
>> On Fri, Nov 1, 2013 at 11:22 AM, Daniel Shaw wrote:
>>
>>> Hi Youmin:
>>>
>>>
>>>
>>> To perform an electrostatic-structural simulation using Mechanical APDL
>>> (aka “classic ANSYS”), you can use either the 22x coupled-field elements,
>>> the multi-field solver (MFS), or the electro-mechanical transducer
>>> element
>>> (TRANS126). You could also use the reduced order
>>> electrostatic-structural
>>> element (ROM144). The 22x elements and the MFS use a sequential coupling
>>> approach. TRANS126 and ROM144 use a matrix coupling approach.
>>>
>>>
>>>
>>> If possible, I recommend using TRANS126. It is the simplest and most
>>> robust approach. With the 22x elements and the MFS, you might have
>>> meshing
>>> issues at pull-down. ROM144 can be complicated to implement. If
>>> fringing
>>> effects are significant, TRANS126 might be difficult to accurately
>>> implement. In that case, you need to use one of the other methods.
>>>
>>>
>>>
>>> Regards,
>>>
>>>
>>>
>>> Daniel Shaw
>>>
>>> ANSYS, Inc.
>>>
>>>
>>>
>>> On Wed, Oct 30, 2013 at 9:50 PM, Youmin Wang >> >wrote:
>>>
>>> > Dear Friends,
>>> >
>>> > I am starting to use Ansys for the modeling of MEMS micromirror
>>> > static/dynamic analysis. There have been many previous work in this
>>> field,
>>> > but according to my observations, 3 key technologies were basically
>>> used
>>> > for MEMS electromechanical coupling, which are 1. using Coupled Field
>>> > Element (SOLID226); 2. Multi-field solver; and 3. Trans126.
>>> >
>>> > Seems for method #1 I have to use air to enclose the whole device if
>>> fringe
>>> > electric field needs to be considered, but in "Gyimesi, Miklos, Ilya
>>> > Avdeev, and Dale Ostergaard. "Finite-element simulation of
>>> > micro-electromechanical systems (MEMS) by strongly coupled
>>> > electromechanical transducers." Magnetics, IEEE Transactions on 40.2
>>> > (2004): 557-560." it says in large deformation bending electrode
>>> problem,
>>> > Trans126 might not be suitable.
>>> >
>>> > Do you guys have any previous experience on this selection issue?
>>> Besides,
>>> > seems Trans126 also requires the pre-stress definition, which I am
>>> still
>>> > struggling to find out where to apply...
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>>> _______________________________________________
>>> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
>>> provider of MEMS and Nanotechnology design and fabrication services.
>>> Visit us at http://www.mems-exchange.org
>>>
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>>
>>
>