Hi,

I am gathering information for an experiment to sputter platinum on non-
conducting substrates such as G10, G11, FR4 and PCB board substrates. If anyone
of the team point out to good resources/references or any personal experience
will help me have a starting point. I need to answer the following questions

1.       What kind of adhesion layer is required in case adhesion is poor on the
above substrates?

2.       If adhesion layer required what thicknesses are feasible to balance the
stress between substrate and Pt thin film (~400 µ)

3.       Is outgassing during sputtering an issue and if issue is there what
remedy exists?

4.       Is substrate material leaks out and contaminate the Pt thin film?

5.       If contamination occurs then is there any remedy exists?

Any help to address above mentioned points and more will be highly appreciated.

Asghar Gill
Abbott Point of Care
Canada

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