Hello Ahmed,

what kind of problems do you face with using primer? Would it be possible to
optimize priming step in order to avoid the issues, rather than skipping it?
And important information missing - what is the top layer you are spinning
the resist on?

Without a primer you would have issues with adhesion of small structures,
they would either delaminate in developer or if you follow by etch, you
would severely under etch. But it is all relative and depends on dimensions,
smaller the structures easier to lift. If you are making 100 um contact pads
than most probably you would not see any issues, if you want to make 2 um
lines than all would be gone.

With best regards,

Daniel



Daniel Figura

smartfabgroupT Company

process consulting . data processing . fab software

Phone: +421 944 45 26 86

E-mail: [email protected], Web: www.smartfabgroup.com



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-----Original Message-----
From: [email protected]
[mailto:[email protected]] On
Behalf Of Haider, Ahmad M
Sent: Monday, January 13, 2014 21:17
To: [email protected]
Subject: [mems-talk] Shipley 1827 resist without hmds or p20 primer

Hi,

I am using Shipley 1827 resist for photolithography. Till now, I always have
a pre step in which I spin p20 primer onto the wafer and then I spin the
1827 resist onto the wafer. I am facing certain problems with this. Can I
just spin 1827 on a clean wafer directly? Can I get some help with the
process parameters?

Thanks
Ahmad
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