Hi Ricky,

You don't need an inherently-conductive resist for subsequent electroplating, as
electroformers are used to applying a very thin coating of silver (sprayed on,
or vacuum-applied). The later can be applied in a "box coater".
Then you plate on your final metal.
Silver's adhesion to the resist is not (intended to be) high, so if you need
high adhesion...

Sincerely, George Gregoire, as President, DIT, Inc.

________________________________

Dimensional Imprint Technology, Inc.
9927 Aviary Drive, San Diego, CA 92131 USA   (858) 549-4290
[email protected]

Dimensional invented & developed Imprint Patterning(tm)technology, the "Less =
More" process tech for advanced PWBs.

________________________________

DIT's customer 'pitch': You have heard of Moore’s Law. Less well known is the
resulting crisis in advanced circuits
that serve as the basic wiring connecting these increasingly dense chips.
Dimensional Imprint Technologyis a newer company leveraging 10 years of research
and development, with a better, yet drop-in, method of printed circuit
fabrication - using conventional fabs - no new capex required!. Dimensional is
allowing OEMs and fabricators to employ its patented breakthrough technologyfor
circuit fabrication with virtually no limit on performance, and with a
disruptive cost advantage. The basic processes are already used commercially in
other applications.



>________________________________
>From: Ricky Anthony 
>To: "[email protected]" 
>Sent: Thursday, January 23, 2014 8:10 AM
>Subject: [mems-talk] Thick Conductive resist
>
>
>Hi,
>
>I was wondering if there is any material developed: a thick resist, like SU-8
which would be conductive enough to act as seed for electroplating.
>
>
>Many Thanks,
>
>Ricky Anthony
>
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