Hi.

at first, I want you to understand that I don't know english very well.


I performed Cu deposition process(3000Å) for forming electrode(for
electroplating)

and I wil perform PR patterning on Cu layer and Ni electroplating.

I would like to know if Cu film can oxidize naturally after 1~2 days.

if Cu film oxidizes, it affects Ni electroplating??

ex) oxidized Cu layer can I no longer use for electrode for electroplating???


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