aluminum and copper are two mostly used... copper has higher conductivity but
due to high diffusion coefficient add seed layer below it..








Regards,
Bhargav Panchal
+91 9742712671
On Monday, 7 April 2014 7:50 PM, Amit Kumar  wrote:

Can you please tell about the metal layers used in device fabrication..?????


On Fri, Apr 4, 2014 at 12:18 PM, Jerry Chen  wrote:

> i think the stripper is called Omni coat, a product from Microchem.
>
>
> On Thu, Apr 3, 2014 at 7:54 PM, shay kaplan  wrote:
>
> > SU8 is an epoxy and you need an epoxy stripper to take it off.
> > If I remember right, Microchem sells a material that you spin under the
> > SU8 that enables you to remove it later
> >
> > -----Original Message-----
> > From: [email protected] [mailto:
> > [email protected]] On Behalf Of ???
> > Sent: Thursday, April 03, 2014 8:28 AM
> > To: General MEMS discussion
> > Subject: [mems-talk] su-8 2002 removal method
> >
> > I used SU-8 2002 for sacrificial layer(about 2um).
> >
> > after whole process is finished, I want to remove SU-8 layer.
> >
> > but, it is very hard. I used Remover PG(80℃, 30min) but it is
> > indissolubleness(?).
> >
> > For forming mems sensor, the metal layers are deposited around a SU-8
> > layer.
> >
> > So I want to remove SU-8 2002 without damages of other structures.
> >
> > How can I do it?
> > _______________________________________________
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--
With Regards

Amit Kumar
QHS(T)
Sensor & Nanotechnology Group
CSIR-CEERI, Pilani
Rajasthan-333031

_______________________________________________
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_______________________________________________
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provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

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