Good day everyone,
I am carrying out some experiments to determine the best values for current
density, voltage, etc. for electroplating indium onto gold pads.  Has anyone
tried this before?  If so, what did you come up with for the proper amount
current density, thickness of deposition expected, and any other parameters
that need to be considered.
Also, if this process were to be used on MEMS, is there any "practical" or
"feasable" method to plate the gold pads without damaging them.  Right now
it seems the only route to take would be attaching a microprobe to each gold
pad desired to be plated and wait it out...that would take forever.  So, any
ideas on how to efficiently plate gold pads on MEMS without destroying them?
Thanks,
Jon Erickson


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