following situations may be true:
1. the mask you prepared if by (wet etching ) might have different
dimensions than conceived in design.
2. you are under etching after exposure, in that increase time for etching
in SU8 developer.
3. you have a heating process after etching.


On Mon, Jul 28, 2014 at 12:58 PM, Janis Klavins 
wrote:

> Hello all,
>
> I have a strange problem with SU8 structures. When we expose and develop
> the structure it is wider than necessary in SEM image it is possible to see
> that those wider areas are somehow different and the side of the structure
> is "fluffy" not straight and even. (see the image below.
> I believe it might be one of the following:
> 1) Over-exposure: I cannot change exposure time due to additional adhesion
> problems
> 2) Mask is in proximity instead of contact mode: thickness of coating
> varies by 1 um (I do not think that it should make such a problem)
> 3) Something wrong in Post-exposure (too long or too hot)
>
> Does anyone with greater experience with SU8 could suggest anything?
>
>
> --
> Best regards,
> Mr. Janis Klavins
> EuroLCDs
> Phone: +37163600300
> Mobile: +37126141049
>
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