Can you elaborate how you are determining this shrinkage? During softbake
there will be loss of solvents and a change in thickness, but it should not
cause any stresses because the uncured SU8 should reflow above 65C. Perhaps
your ramp rate is too fast causing part of the SU8 to flow while other
parts are still solid?

On Wed, Oct 22, 2014 at 10:49 PM, KarthiKeyan K 
wrote:

> Dear All,
>
> I am facing shrinkage problem on SU8 2075 photoresist layer on Silicon
> Substrate. Actually this problem accruing on soft backing process at 65C on
> hotplate & hot air oven also.
>
> Kindly suggest to over come this problem.
>
> Thanking you,
>
> Best Regards,
> Karthi
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