Dear sir,

Thanks for your mail and information.

Actually the SU8 photo resist is spined by spin coater at 2500rpm during
this process I got uniform coating and then I goes to soft backing for 65c,
when I put it on the hotplate or hot air oven (with in 2-3 min) the coated
su 8 layer will be shrinkaged and or some times non uniform surface layer
on su8 layer during soft backing process.

Which one is prefereable for soft/hard backing whether hot plate or air
oven???

Looking forward to your suggestion.

Thanking you,

Best regards,
Karthi

On Oct 24, 2014 12:55 AM, "Andrew Sarangan"  wrote:
>
> Can you elaborate how you are determining this shrinkage? During softbake
> there will be loss of solvents and a change in thickness, but it should
not
> cause any stresses because the uncured SU8 should reflow above 65C.
Perhaps
> your ramp rate is too fast causing part of the SU8 to flow while other
> parts are still solid?
>
> On Wed, Oct 22, 2014 at 10:49 PM, KarthiKeyan K 
> wrote:
>
> > Dear All,
> >
> > I am facing shrinkage problem on SU8 2075 photoresist layer on Silicon
> > Substrate. Actually this problem accruing on soft backing process at
65C on
> > hotplate & hot air oven also.
> >
> > Kindly suggest to over come this problem.
> >
> > Thanking you,
> >
> > Best Regards,
> > Karthi
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