Hello Leily,
holes in the glass wafers is one of the best ways to connect the
microchannels. There are different techniques like drilling, ultrasonic
drilling, laser and powder blasting. For getting enough fluid through the
inlets they should have a width of several hundreds of µm. For doing powder
blasting you can contact me: [email protected]
Regards,
André Bödecker
-----Ursprüngliche Nachricht-----
Von: [email protected]
[mailto:[email protected]] Im
Auftrag von Leily Majidi
Gesendet: Mittwoch, 22. April 2015 00:21
An: [email protected]
Betreff: [mems-talk] Tips for fabrication of microchannel heat sinks
Hello,
For my project, I want to fabricate microchannels on silicon wafer and I
need some help.I have a 4 inch silicon wafer and my channels are going to be
etched on chips with the dimensions of 15 mm by 15 mm. The channels are
300 micron deep and the smallest width of channels is 50 microns. Another
thing is that my coolant is a segmented glow containing liquid metal
(Galinstan) and mineral oil, and Galinstan is corrosive to metals.
I read in different literature that anodic bonding is used to cover the chip
with glass. If I use the same process, how can I connect my inlet and outlet
tubes to the chip to pump the coolant? Should I make holes on glass?
I'd appreciate any help.
Thank you
Leily
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provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org
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