Hi Leily,
The easier solution will be to design and make a manifold that will connect
to the chip from the sides. But, this might require the chip to be larger on
the channel direction than the chip you want to cool. because the manifold
fits to the diced side of the chip and it will be hard to glue it to the
side and seal well enough without clogging the channel ends. You will want
the manifold to seal above and below the chip.
Shay
-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Leily
Majidi
Sent: Wednesday, April 22, 2015 1:21 AM
To: [email protected]
Subject: [mems-talk] Tips for fabrication of microchannel heat sinks
Hello,
For my project, I want to fabricate microchannels on silicon wafer and I
need some help.I have a 4 inch silicon wafer and my channels are going to be
etched on chips with the dimensions of 15 mm by 15 mm. The channels are
300 micron deep and the smallest width of channels is 50 microns. Another
thing is that my coolant is a segmented glow containing liquid metal
(Galinstan) and mineral oil, and Galinstan is corrosive to metals.
I read in different literature that anodic bonding is used to cover the chip
with glass. If I use the same process, how can I connect my inlet and outlet
tubes to the chip to pump the coolant? Should I make holes on glass?
I'd appreciate any help.
Thank you
Leily
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provider of MEMS and Nanotechnology design and fabrication services.
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