Hi everyone.

For my project, I want to fabricate chips containing microchannels on
silicon wafer and I need some ideas for sealing the chip and making a cover
on top of it including the inlet/outlet holes.I have a 4 inch silicon wafer
and my channels are going to be etched on chips with the dimensions of 25
mm by 15 mm. The channels are 300 micron deep and the surface area of the
channel section is smaller than the main chip. I read in different
literature that anodic bonding is used to cover the chip with glass. But it
seems making the inlet/outlet holes on glass might be tricky.
I wanted to know whether it is possible to use PDMS bonding to silicon. Do
you think it will seal the chip properly?

I'd appreciate any help.
Thank you
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