I am trying to develop a repeatable liftoff process using LOR10B and an
1800 series positive resist for use with 1:1 microdev developer (necessary
for material compatibility). The trouble arises in the repeatability of the
process. Time of development varies significantly between runs with no
process parameters changing yielding far too much undercut for our
application. We have the LOR thinner and have by trying to work with that
as well as full thickness LOR.

Does anyone have a repeatable process or suggestions?


Joshua
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

Want to advertise to this community?  See http://www.memsnet.org

To unsubscribe:
http://mail.mems-exchange.org/mailman/listinfo/mems-talk