Thanks for the input. Unfortunately we are limited to using microdev
developer for this process due to material compatibility. We are also not
using an automated developing system. I have done quite a few experiments
using different bake times and temperatures and have also found that higher
temperatures at longer times works best. The biggest issue we are seeing is
small LOR dots in the exposed area that will not develop away.  They appear
random and vary in thickness. Some of the features are smaller and these
"dots" cause the device to be rendered unusable after metallization.

Joshua

On Tue, Jul 14, 2015 at 12:52 AM, André Bödecker <
[email protected]> wrote:

> We had also problems while using an automatic developing device. The
> undercut depends among other things on the abrasive effect of the spraying
> direction of the developer tool. We made better experience with manual
> developing in a petri dish and always using fresh developer.
>
> André
>
> -----Ursprüngliche Nachricht-----
> Von: [email protected]
> [mailto:[email protected]] Im
> Auftrag von Joshua Wells
> Gesendet: Freitag, 10. Juli 2015 13:43
> An: [email protected]
> Betreff: [mems-talk] Liftoff Process Using LOR 10B and 1800 Series Resist
>
> I am trying to develop a repeatable liftoff process using LOR10B and an
> 1800 series positive resist for use with 1:1 microdev developer (necessary
> for material compatibility). The trouble arises in the repeatability of the
> process. Time of development varies significantly between runs with no
> process parameters changing yielding far too much undercut for our
> application. We have the LOR thinner and have by trying to work with that
> as
> well as full thickness LOR.
>
> Does anyone have a repeatable process or suggestions?
>
>
> Joshua
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_______________________________________________
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